H-I-[1-5] - Solder Termination Sleeve
High-Temperature Solder Termination Device, Infrared Heating
NAS 1746
Product Overview
Category
Solder Terminations Sleeves
H-I Series
Solder Termination Sleeve, Immersion Resistant NAS 1746 Qualified, Sn63, Flux RMA, For Silver or Tin Applications
Material
INSULATION SLEEVE:HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE. MELTABLE SEALING RING:HERMALLY STABILIZED THERMOPLASTIC. COLOR = 2 BLUE. SOLDER PREFORM:ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROL1 TYPE RMA FLUX FOR SILVER OR TIN APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1746
Industry
Aerospace, Solder Termination
Environmental compliance
Not RoHS compliant
Specifications/Approvals
NAS 1746
Other
N/A
Basic Properties
| Sumitomo Part Number | L ∓ .062 | øD Minimum | øD1 Minimum |
|---|---|---|---|
| H-I-1 | .590 | .075 | .095 |
| H-I-2 | .590 | .110 | .125 |
| H-I-3 | .590 | .180 | .200 |
| H-I-4 | .590 | .235 | .250 |
| H-I-5 | .590 | .280 | .300 |
*For reference use only
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