SM3-23

3:1 Continuous Printable Overexpanded Polyolefin

AS23053/5 Class 1 UL/CSA recognized 125° C 600 V (VW-1)

Product Overview

Category
Heat-shrinkable tubing
Material
Overexpanded Polyolefin
Shrink ratio
3:1
Shrink temperature
90° C
Continuous operating temperature
-55° C to +135° C
Available colors
Black, Yellow, White
Flammability
Flame Retarded
Environmental compliance
RoHS/RoHS2
Specifications / Approvals
Other

Additional Information

Design Continuous
Mark Performance SAE-AS5942
Fluid Resistance -
Recommended Printer -
Recommended Ribbon SM3 Black Standard
Software Sumilabel

Basic Properties

Property Test Method Requirement
Physical:
Tensile Strength ASTM D 638 1500 min.
Elongation (%) ASTM D 638 200 min.
Specific Gravity ASTM D 792 1.35 max
Low Temperature Flex (-55° C) AMS-DTL-23053 No cracking
Heat shock (250° C, 4 hrs.) AMS-DTL-23053 No cracking
Heat resistance (175° C, 168 hrs.)
Elongation (%) ASTM D 638 100 min.
Longitudinal change (%) AMS-DTL-23053 +5, -15
Secant Modulus (psi) ASTM D 882 2.5 X 104 max
Electrical:
Dielectric strength (volts/mil) ASTM D 876 500 min.
Volume resistivity (ohm-cm) ASTM D 876 1.0 X 1014 min.
Chemical:
Corrosion (175° C, 16 hrs.) UL 224 no corrosion
Water absorption (%) ASTM D 570 0.5 max.
Fluid resistance (23° C, 24 hrs.)
Tensile strength (psi) AMS-DTL-23053 1000 min.
Flammability UL 224 Pass
Shrink temperature, nominal 90° C

*For reference use only

Sizes

Nominal Size ID Minimum (As Supplied) ID Maximum (After Recovery) Wall Thickness Nom (After Recovery)
Inches MM Inches MM Inches MM
1/16″ .063 1.6 .021 0.5 .020 0.5
1/8″ .125 3.2 .062 1.6 .020 0.51
3/16″ .187 4.8 .093 2.4 .020 0.51
1/4″ .250 6.4 .125 3.2 .025 0.64
3/8″ .375 9.5 .187 4.8 .025 0.64
1/2″ .500 12.7 .250 6.4 .025 0.64
3/4″ .750 19.1 .375 9.5 .030 0.76
3/4″ .750 19.1 .375 9.5 .030 0.76
1″ 1.00 25.4 .500 12.7 .035 0.89


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For any information please Contact Us

Sumitomo Electric Interconnect Products, Inc.
915 Armorlite Drive, San Marcos, CA 92069

T: (760) 761.0600 info@seipusa.com

World leaders in identification
and heat-shrink technology

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