H-C4-[1-4] - Solder Termination Sleeve
High Temperature Convection Heated, 150℃
NAS 1744
Product Overview
Category
Solder Terminations Sleeves
H-C Series
Solder Termination Sleeve, Immersion Resistant NAS 1744 Qualified, Sn63, Flux RMA, For Tinned or Silver Plated Wires
Material
INSULATION SLEEVE:HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE. MELTABLE SEALING RING:THERMALLY STABILIZED THERMOPLASTIC. COLOR = 2 CLEAR SOLDER PREFORM:ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROL1 TYPE RMA FLUX FOR TIN OR SILVER APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1744
Industry
Aerospace, Solder Termination
Environmental compliance
NON-RoHS
Specifications/Approvals
NAS 1744
Other
N/A
Basic Properties
| Sumitomo Part Number | L ∓ .062 | øD Minimum | øD1 Minimum |
|---|---|---|---|
| H-C4-1 | 1.125 | .075 | .095 |
| H-C4-2 | 1.125 | .110 | .125 |
| H-C4-3 | 1.125 | .180 | .200 |
| H-C4-4 | 1.125 | .280 | .300 |
*For reference use only
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