H-C4-[1-4] - Solder Termination Sleeve

High Temperature Convection Heated, 150℃

NAS 1744
Product PDF

Product Overview

Category
Solder Terminations Sleeves
H-C Series
Solder Termination Sleeve, Immersion Resistant NAS 1744 Qualified, Sn63, Flux RMA, For Tinned or Silver Plated Wires
Material
INSULATION SLEEVE:
HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE. MELTABLE SEALING RING:
THERMALLY STABILIZED THERMOPLASTIC. COLOR = 2 CLEAR SOLDER PREFORM:
ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROL1 TYPE RMA FLUX FOR TIN OR SILVER APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1744
Industry
Aerospace, Solder Termination
Environmental compliance
NON-RoHS
Specifications/Approvals

NAS 1744

Other
N/A

Basic Properties

Sumitomo Part Number L ∓ .062 øD Minimum øD1 Minimum
H-C4-1 1.125 .075 .095
H-C4-2 1.125 .110 .125
H-C4-3 1.125 .180 .200
H-C4-4 1.125 .280 .300

*For reference use only



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