H-C5-[5-22] - Solder Termination Sleeve

High Temperature Convection Heated, 150℃

NAS 1745
Product PDF

Product Overview

Category
Solder Terminations Sleeves
H-C Series
Solder Termination Sleeve, Immersion Resistant NAS 1745 Qualified, Sn63, Flux RA, For Nickel Applications
Material
INSULATION SLEEVE:
HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE. MELTABLE SEALING RING:
THERMALLY STABILIZED THERMOPLASTIC. COLOR = 1 CLEAR, 1 BLUE.
SOLDER PREFORM:
ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROM1 TYPE RA FLUX FOR NICKEL APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1745
Industry
Aerospace, Solder Termination
Environmental compliance
NON-RoHS
Specifications/Approvals

NAS 1745

Other
N/A

Basic Properties

Sumitomo Part Number L ∓ .062 øD Minimum øD1 Minimum
H-C5-5 .625 .075 .095
H-C5-6 .625 .110 .125
H-C5-7 .625 .180 .200
H-C5-8 .750 .280 .300
H-C5-20 .750 .235 .255
H-C5-21 1.100 .440 .460
H-C5-22 1.100 .525 .545

*For reference use only



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