H-C5-[5-22] - Solder Termination Sleeve
High Temperature Convection Heated, 150℃
NAS 1745
Product Overview
Category
Solder Terminations Sleeves
H-C Series
Solder Termination Sleeve, Immersion Resistant NAS 1745 Qualified, Sn63, Flux RA, For Nickel Applications
Material
INSULATION SLEEVE:HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE. MELTABLE SEALING RING:THERMALLY STABILIZED THERMOPLASTIC. COLOR = 1 CLEAR, 1 BLUE. SOLDER PREFORM:ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROM1 TYPE RA FLUX FOR NICKEL APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1745
Industry
Aerospace, Solder Termination
Environmental compliance
NON-RoHS
Specifications/Approvals
NAS 1745
Other
N/A
Basic Properties
| Sumitomo Part Number | L ∓ .062 | øD Minimum | øD1 Minimum |
|---|---|---|---|
| H-C5-5 | .625 | .075 | .095 |
| H-C5-6 | .625 | .110 | .125 |
| H-C5-7 | .625 | .180 | .200 |
| H-C5-8 | .750 | .280 | .300 |
| H-C5-20 | .750 | .235 | .255 |
| H-C5-21 | 1.100 | .440 | .460 |
| H-C5-22 | 1.100 | .525 | .545 |
*For reference use only
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