H-I-[1-5] - Solder Termination Sleeve

High-Temperature Solder Termination Device, Infrared Heating

NAS 1746
Product PDF

Product Overview

Category
Solder Terminations Sleeves
H-I Series
Solder Termination Sleeve, Immersion Resistant NAS 1746 Qualified, Sn63, Flux RMA, For Silver or Tin Applications
Material
INSULATION SLEEVE:
HEAT-SHRINKABLE, RADIATION CROSSLINKED, MODIFIED POLYVINYLIDENE FLUORIDE. COLOR = TRANSPARENT BLUE.
MELTABLE SEALING RING:
HERMALLY STABILIZED THERMOPLASTIC. COLOR = 2 BLUE.
SOLDER PREFORM:
ALLOY - Sn63 EUTECTIC AT 183°C. PER ANSl-J-STD-006. FLUX- ROL1 TYPE RMA FLUX FOR SILVER OR TIN APPLICATIONS PER ANSl-J-STD-004
Shrink Ratio
N/A
Shrink Temperature
N/A
Continuous operating temperature
-55℃ to +150℃
Flammability
Per NAS 1746
Industry
Aerospace, Solder Termination
Environmental compliance
Not RoHS compliant
Specifications/Approvals

NAS 1746

Other
N/A

Basic Properties

Sumitomo Part Number L ∓ .062 øD Minimum øD1 Minimum
H-I-1 .590 .075 .095
H-I-2 .590 .110 .125
H-I-3 .590 .180 .200
H-I-4 .590 .235 .250
H-I-5 .590 .280 .300

*For reference use only



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